Prototyping Services

From file to
finished part.

Rapid 3D printing, multi layer PCB fabrication, custom enclosures, POC sampling with custom firmware, battery packs, and turnkey electronic product manufacturing under one roof with engineering support at every step.

3D Printing Services

Fused Deposition Modeling with PLA, ABS, PETG, TPU, and carbon fiber composites. From rapid prototypes to functional end use parts.

Request a Print
Layer resolution up to 0.1mm
PLA, ABS, PETG, TPU and CF Nylon
Same day prints available
Post processing included

PCB Fabrication

Single sided to 8 layer boards. We handle design review, fabrication, and assembly, from bare boards to fully populated units.

2 layer from ₹200
SMD and through hole assembly
DFM review included
Stencils available

Custom Enclosures

CNC machined, 3D printed, or sheet metal enclosures designed for your electronics. IP rated options available.

CAD ready design support
Multiple material options
Threaded inserts and standoffs
Small batch production

POCs and Rapid Sampling

Turn concepts into working physical hardware with rapid functional Proof of Concept builds and quick turn sampling. Complete hardware engineering accompanied by custom embedded firmware development and hardware programming.

Concept to functional POC samples
Custom embedded firmware development
Hardware programming and flashing
Board bring up and sensor integration

Custom Battery Packs

Custom Lithium Ion and LiFePO4 battery pack engineering. Precision spot welding, integrated Smart BMS protection, thermal management, and custom casings.

Custom voltage and capacity configurations
Integrated Smart BMS protection
High current pure nickel spot welding
Thermal isolation and vibration testing

Electronic Product Manufacturing

Turnkey contract manufacturing for high quality electronic devices. From component procurement and high density SMT to firmware flashing, box build assembly, and final testing.

Turnkey box build and final device assembly
Component sourcing and BOM optimization
Firmware flashing and functional testing
Retail packaging and QA certification

Engineering Standards

Engineering Capabilities and Technical Specifications

In depth technical capabilities, fabrication limits, and rigorous quality standards across all hardware engineering and prototyping disciplines.

Hardware & Firmware

Proof of Concept (POC) and Rapid Sampling

  • Architecture Design: ESP32, STM32 ARM Cortex, Nordic nRF52 BLE, Raspberry Pi RP2040, and Microchip AVR platforms
  • Firmware Programming: Bare metal C and C++, FreeRTOS multitasking, custom peripheral driver creation, and automated flashing
  • Sensor Integration: I2C, SPI, UART, CAN bus, RS485 communication, and precision analog signal conditioning
  • Rapid Hardware Bring Up: Power distribution validation, clock frequency verification, and oscilloscope logic analysis
Instant DFM & Quote Available
1 to 8+ Layers

Multi Layer PCB Fabrication and Assembly

  • Board Specifications: Single sided up to 8 layer high density FR4 circuit boards with controlled dielectric stacks
  • Surface Treatments: Lead free HASL, ENIG immersion gold, and organic solderability preservative OSP finishes
  • Fabrication Tolerances: 0.1mm minimum trace width and spacing with 0.2mm mechanical hole drill precision
  • Surface Mount Assembly: Automated pick and place for 0201 passives, QFN, BGA packages, and automated optical inspection
Instant DFM & Quote Available
CNC & Additive

Custom Electronic Enclosures and Casings

  • Subtractive Machining: Precision CNC milling in aerospace grade aluminum 6061, POM Delrin, and polycarbonate
  • Ingress Protection: Custom molded silicone sealing gaskets engineered to achieve IP54, IP65, and IP67 weather resistance
  • Hardware Integration: Thermally installed brass threaded inserts, captive screw standoffs, and light pipe guides
  • Surface Treatments: Bead blasted anodization in custom colors, powder coat finishes, and laser etched labeling
Instant DFM & Quote Available
Li-Ion & LiFePO4

Custom Battery Pack Engineering

  • Cell Chemistries: High discharge 18650 and 21700 Lithium Ion cells along with long lifecycle LiFePO4 prismatic configurations
  • Welding Technology: Pure copper and nickel interconnect spot welding delivering high current capability without heat degradation
  • Smart Battery Management: Integrated BMS supporting CAN bus, RS485, SMBus, and Bluetooth real time telemetry
  • Safety Assurance: Overcurrent cutoffs, cell balancing networks, thermal isolation barriers, and vibration dampening
Instant DFM & Quote Available
Turnkey Box Build

Turnkey Electronic Product Manufacturing

  • Supply Chain Optimization: Verified distributor component sourcing with active bill of materials obsolescence monitoring
  • Box Build Integration: Complete electromechanical product assembly, internal wire harness routing, and conformal coating
  • Automated Testing: Dedicated bed of nails fixtures, automated functional test benches, and burn in thermal cycling
  • Packaging and Compliance: Electrostatic discharge safe retail packaging, unique serialization barcodes, and quality documentation
Instant DFM & Quote Available
Additive Manufacturing

Industrial 3D Printing and Rapid Prototyping

  • Material Versatility: Engineering grade PLA, ABS, PETG, flexible TPU 95A, and carbon fiber reinforced nylon composites
  • Resolution and Detail: Adaptive layer heights between 0.08mm and 0.28mm with dimensional accuracy within 0.15mm
  • Fast Turnaround: Same day print starts for urgent validation models, ergonomic fit checks, and functional enclosures
  • Post Processing Options: Support removal, threaded tapping, vapor smoothing, surface sanding, and chemical bonding
Instant DFM & Quote Available

How it works

Simple, transparent process

01

Share your requirements

Upload CAD files, schematics, or describe your project concept.

02

Instant Precision Quote

Our engineering team provides a detailed technical quote and DFM assessment within 24 hours.

03

Production begins

After approval, fabrication starts with real time progress updates.

04

Quality check and delivery

Every piece undergoes strict inspection before dispatch. Pan India shipping included.

Creality Ender 3 V3

FDM Printer

220x220x250mm build volume

BambuLab P1S

FDM Printer

Multi color, enclosed, high speed

Anycubic Photon Mono

Resin Printer

0.01mm XY resolution

Keysight DSOX1204G

Oscilloscope

4 channel, 200 MHz bandwidth

JBC CD 2BQF

Soldering Station

Precision tip, ESD safe

Rigol DG1022Z

Function Generator

Dual channel, 25 MHz

Ecosystem Partners

Materials and components from the best.

Creality
BambuLab
Anycubic
Prusa
eSUN
Polymaker
Espressif
Microchip
Texas Instruments
STMicroelectronics
Raspberry Pi
Arduino
JLCPCB
Molex
TE Connectivity
Creality
BambuLab
Anycubic
Prusa
eSUN
Polymaker
Espressif
Microchip
Texas Instruments
STMicroelectronics
Raspberry Pi
Arduino
JLCPCB
Molex
TE Connectivity